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Exhibitors

Exhibit packages for Microtech Innovation Summit 2019 are available. For further information and questions about exhibiting, please click here.


Founded in 1995 and located in Finland AFORE is a pioneer supplier of test equipment for the MEMS industry and related markets. We are specialized in providing solutions for consumer, industrial and automotive applications. Our products are utilized in sensor and semiconductor industry from R&D and characterization to high-volume manufacturing, wherever there’s a demand for high accuracy testing in environmental or motion stimulus. Being part of the AEM Group, we take pride in providing innovative, engineering-focused solutions and developing strong partnerships with customers and associates to cater to their manufacturing needs through our global engineering service support network and innovative people. Through our network of sales offices, associates and distributors, AEM and AFORE have global market presence spanning Asia, Europe and the United States.


Covalent Metrology is a one-stop-shop for measurement and characterization services and expertise. We offer in-house measurement and imaging of advanced materials, coatings and devices as well as a single point of contact to access a wide network of specialized service labs and instrument makers around the world. Covalent partners with customers, leveraging our metrology expertise, network and infrastructure to solve development challenges, improve products and increase yields. Our customers work in many industries including semiconductor manufacturing, photonics, and energy storage, generation and conservation (e.g., batteries, PV, glass or thermal coatings).


ePack, Inc is the leading innovator for value-added sensor packaging solutions. We provide package designs, packages and package assembly services which improve the performance of your sensors. Our packaging solutions generally allow for you to keep the same package footprint and form factor while eliminating stress, temperature and/or vibration effects on your device. Additionally, ePack’s packaging solutions provide cost savings either for your product or your customer’s product and can scale to any production volume. Please contact us for more information. Development of our current products started in 2013, and ePack launched its first product in 2017. ePack, Inc. is headquartered in Ann Arbor, MI.


Eshylon Scientific is revolutionizing thin wafer handling and the temporary bonding market with its innovative, multi-patented mobile electrostatic carriers (MESCs), offering customers unprecedented control over their most challenging substrate handling requirements. The Eshylon MESC platform delivers unmatched ROI for thin wafer handling, fab retrofit and wafer thinning applications through extraordinary yield, versatility, cost and throughput.


Micralyne is a leading independent MEMS foundry, and volume manufacturer of novel MEMS devices with over 30 years of MEMS development and manufacturing expertise. Micralyne’s fabrication solutions have been used in MEMS sensors for precise measurement devices, MEMS optical switching technology, lab-on-a-chip components, micro-needles, pressure sensors, gas sensors, accelerometers, thermal imaging sensors, and microfluidics. We are both ISO9001 and ISO13485 certified. Micralyne’s MEMS foundry model allows clients to access enhanced services such as validated MEMS technology processes and platforms, advanced packaging – WLP, TSV, TGV, discrete and custom sub-assembly services. This foundry model has successfully produced products for industries such as: bio-medical, aerospace, automotive, oil and gas, telecom, and industrial sensors. Micralyne offers our customers a strategic partnership with deep technical knowledge and fabrication capabilities coupled with an integrated quality and project management support. Connect with us today and leverage our experience to manufacture your MEMS devices.


We provide innovative lab-on-a-chip and MEMS solutions: solutions that will help our customers improve their products and research, contributing to the quality of life. Our unique combination of micro- and nanotechnologies, different materials, microfluidics and MEMS knowledge and customer application knowhow, enables us to provide our customers with the innovative and sustainable solution they are looking for. Micronit was founded in 1999, with its initial focus on the miniaturisation of devices using micro technology. After a few years our focus shifted to microfluidics for life sciences applications. Since then we have transformed from a parts supplier to a lab-on-a-chip and bioMEMS product development and manufacturing partner, providing our customers with total solutions.


Since 1980, Nikon Corporation has been revolutionizing lithography with innovative products and technologies. The company is a worldwide leader in semiconductor lithography systems for the microelectronics manufacturing industry with more than 8,000 (semiconductor) lithography systems installed worldwide. Nikon offers the most extensive selection of production-class steppers and scanners in the industry. These products serve the semiconductor, flat panel display (FPD) and thin-film magnetic head (TFH) industries. The extensive Nikon product portfolio includes specialized lithography solutions for MEMS, LED, and packaging applications as well. Nikon Precision provides service, training, applications and technical support, as well as sales and marketing for Nikon lithography systems worldwide.


OnScale is the world’s first Solver-as-a-Service platform – a combination of advanced computer-aided engineering (CAE) multi-physics solvers with a scalable cloud high-performance computing (HPC) engine. OnScale breaks performance barriers for engineers by providing near-limitless Cloud HPC resources to solve today’s toughest engineering challenges. OnScale also breaks cost barriers for engineering teams of all sizes by providing world-class CAE multi-physics solvers and Cloud HPC on a subscription-based pay-as-you-go pricing model. With OnScale, engineers can run massive multi-million degree-of-freedom multi-physics simulations and vast numbers of simulations in parallel to optimize systems like ultrasonic transducer arrays for near-field 3D object classification for ADAS applications very quickly with minimal cost. Design studies that were once impossible with legacy CAE tools and on-premise HPC are now possible.


When you need custom MEMS & Micro Devices for your system, you can rely on our experts to really understand your requirements. Our 140 experts working at the MEMS Foundry and Micro Devices Facility follow a phase-gated approach to demonstrate feasibility and give proof of concept, develop the process to the required maturity level and manufacture your devices with the right quality.


Plan Optik AG is the leading manufacturer of structured wafers when it comes to technology. In sectors such as consumer electronics, automotive, aerospace, chemistry and pharmaceuticals, these wafers are essential components used as active elements for numerous applications in MEMS technology. The wafers of glass, glass-silicon compounds or quartz are available in sizes up to 300 mm diameter. Wafers by Plan Optik provide high-precision surfaces in the ångström range, which are achieved through the use of the MDF polishing process developed by the company. Plan Optik wafers are available to minimum tolerances with application-specific structuring and complex material combinations. Plan Optik AG's extensive experience in the integration of optical, electronic or chemical functions within a wafer as the basis of MEMS applications has made the company the preferred partner of large international manufacturers.


When you need custom MEMS & Micro Devices for your system, you can rely on our experts to really understand your requirements. Our 140 experts working at the MEMS Foundry and Micro Devices Facility follow a phase-gated approach to demonstrate feasibility and give proof of concept, develop the process to the required maturity level and manufacture your devices with the right quality.


SilTerra Malaysia is a semiconductor wafer foundry offering a full range of process technologies covering our core business in CMOS technologies (advanced logic, RFCMOS, mixed signal and high voltage) to leading edge technologies in MEMS, silicon photonics, bio-photonics and power. SilTerra’s wafer fab has a capacity of 40,000 eight-inch wafers per month. SilTerra also offers MEMS foundry services and a unique MEMS-on-CMOS technology. Under the MEMS foundry services, we help customers realize working prototypes from their proof of concept, support the transfer or set-up of customer owned process and ramp-up to high volume manufacturing (all in one fab). With our MEMS-on-CMOS technology, we have the capability to build the MEMS devices on pre-processed CMOS wafers thus offering a “truly monolithic MEMS integrated solution”. This integrated technology provides a cost-effective, multi-functional chip with a smaller footprint. SilTerra provides proven silicon validated MEMS devices to our customers. SilTerra offers various MEMS on CMOS devices such as: pMUT(piezoelectric micromachined ultrasonic transducers), BAW and SAW (bulk and surface acoustic wave) resonators, optical micro-mirror arrays, zero level package (ZLP), nano-wires, and sensors. Applications include frequency control products, data projectors, finger print sensors, medical imaging and industrial sensors.


SÜSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components. In close cooperation with research institutes and industry partners SÜSS MicroTec contributes to the advancement of next-generation technologies such as 3D integration and nanoimprint lithography as well as key processes for WLP, MEMS and LED manufacturing. With its global infrastructure for applications and service SÜSS MicroTec supports more than 8,000 installed systems worldwide.


Tau Industrial Robotics is producing TiSense, a high-tech table-top solution for environmental MEMS testing with nitrogen free, ultra-fast temperature transition, in combination with additional stimuli (pressure, acoustics etc.).


ULVAC Technologies, Inc. (ULVAC) was established in 1992 as the US subsidiary of ULVAC, Inc. Headquartered in Methuen, Massachusetts, ULVAC provides a broad portfolio of manufacturing equipment for the vacuum, materials and thin film industries. ULVAC's solutions diversely incorporate equipment, materials, analysis, and services for flat panel displays, electronic components, semiconductors, MEMS and general-industry equipment. In addition, the Methuen facility is equipped with a class-10 cleanroom for process development, customer demonstration and manufacturing of the ENVIRO solvent-free dry photo resist stripper and compound semiconductor materials etch systems. Other in-house services include foundry etch (for deep oxide and compound semiconductor materials), thermal processing, materials characterization, and vacuum pump/leak detector repair. ULVAC supports a variety of MEMS production technologies, for applications ranging from micro sensors to flow channel modules, optical switches, and bio-MEMS.


Research and Development Partner

The Fraunhofer Institute for Photonic Microsystems IPMS in Dresden, Germany is your access to know-how, expertise and modern R&D infrastructure in the field of optical sensors and actuators, integrated circuits, microsystems (MEMS/MOEMS) and nanoelectronics. The Fraunhofer IPMS is one of 72 institutes of the Fraunhofer-Gesellschaft, the leading organization for applied research in Germany, and also in Europe. It is devoted to research of practical utility. Relying on 25,000 employees, the Fraunhofer-Gesellschaft has a research budget of 2.6 billion euros.


Exhibit Opportunities

To ensure a more exclusive and intimate networking environment for both the exhibitors and the attendees, the exhibits will only be open to conference attendees. The exhibit package is only $2,995 and includes the following:

  • Two (2) conference passes
  • Printed conference program and presentation slides in electronic format
  • One (1) 6-foot table, draped
  • Two (2) chairs
  • Custom 11”x17” tabletop sign with company logo and description
  • Company logo and description in the printed conference program and on printed conference signage
  • Company logo and description on event website
  • Company logo and description on event dedicated email to subscribers of MEMS Journal and our media partners; event promotions will reach 70,000 to 80,000 individuals in the wearables, sensors, MEMS, electronics, and semiconductor industry segments.

Upgrade to the Deluxe Exhibitor option which enables you to give a 10-minute talk to the entire audience during the Technology Showcase. It's a great way to draw more attention to your company. Deluxe Exhibitor and Technology Showcase spots are limited – click here to register today!

For further information about the exhibits, please contact Jessica Ingram at jessica@memsjournal.com or call at 360-929-0114.

Exhibit space is limited. Sign up today!